Composite molding
Release film for resin and carbon-fiber composite molding.
11 / SPECIALTY MATERIALS
FEP fluoropolymer film
Release, chemical resistance and electrical insulation
For processes requiring low adhesion, chemical resistance or insulation. Select the grade, thickness and surface treatment around the actual process.
FEP is not inherently antistatic. Bonding may require a treated surface; performance depends on grade and operating conditions.
Industry applications
Select the grade and construction for the actual process. Specialized uses require separate qualification.
Electronics and cables
Insulation for flexible circuits, flat cables and wires.
Chemical equipment
Linings, diaphragms, gaskets, sample bags and containers.
Resin 3D printing
Replaceable vat-bottom film for compatible machines. Service life depends on operating conditions.
Biotechnology and cell processing
Specialized FEP bag systems for culture, transfer or cryopreservation. Industrial film alone is not a qualified medical product.
Optical and environmental equipment
Environmental growth chambers and solar collectors, subject to application evaluation.
Semiconductor peripherals
Broader FEP applications include coatings and high-purity fluid systems. This does not qualify this film for wafer processing.
Typical material properties
Reference values only. Final specifications depend on grade, thickness, test conditions and the agreed application.
| Property | Typical value | Test method / condition |
|---|---|---|
| Continuous service temperature | 205°C | — |
| Melting point | 252–282°C | ASTM D3418 |
| Specific gravity | 2.12–2.17 | ASTM D792 |
| Tensile strength | 24 MPa | ASTM D882 |
| Ultimate elongation | 300% | ASTM D882 |
| Water absorption | < 0.01% | 24 h |
| Dielectric strength | 240 kV/mm | ASTM D149 · 1 mil |
| Dielectric constant | 2.1 | ASTM D150 · 1 kHz |
Melting point is not the operating temperature. Contact Kuai Mond for material selection and application evaluation.